Lead-free assembly shifts test methods toward boundary scan
by Dr. Ben Bennetts, DFT Consultant

Worldwide the move is on to eliminate pollution-causing lead from the printed circuit board manufacturing process. Already the European Union (EU) has banned lead from all electronic products as of July 2006. Japan followed suit soon thereafter. The US might not be far behind. The effects of ‘getting the lead out’ on electronic test and the use of JTAG test techniques will be far reaching.

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