ASSET experts grab global headlines

Several new articles and commentaries contributed by ASSET experts have appeared in publications and on industry web sites around the globe in recent months. Links to these and other articles can be found on the “News” page on the ASSET web site.

In the March issue of the German publication, EPP, Glenn Woppman contributed a feature article on emerging standards for the testing of 3D chips. Click here to read this article in German. In addition, a commentary on industry trends appeared under Glenn’s by-line in the German publication, Embedded Design. Click here to read this article in German.

Not to be outdone, Al Crouch, CTO for core instruments, authored an article on 3D chip testing which appeared on the US-based web portal, Future Fab. Click here to read this article in English.

Several other publications will be highlighting ASSET’s expertise in the months ahead. For example, in May in a special test and measurement issue, Elektronik, a German publication, will feature another article by Al Crouch. This one will address the use of the IEEE P1687 IJTAG standard in validation and test applications. And, around the same time, another German publication, Elektronik Industrie, will have a short excerpt and link to a recent whitepaper by Adam Ley, ASSET’s CTO for boundary scan. The whitepaper, which can also be found on the “News” page of the ASSET web site, is titled, “Defect Coverage for Non-Intrusive Board Test.”

Later in the Fall, Alan Sguigna, ASSET’s vice president of sales and marketing, will have contributed an article for Elektronik Industrie on the economics behind the drive toward non-intrusive board test (NBT). Then, in the UK’s Electronics magazine, Glenn Woppman will have an article on the ascendency of embedded instrumentation as the most effective technology for validating and testing high-speed serial buses.